This inventor holds 39 USPTO granted patents and 8 published patent applications and 1 EPO patent, primarily in Microelectronic Packaging. Top assignees: Adeia Semiconductor Bonding Technologies Inc., Adeia Semiconductor Technologies LLC. Active years: 2003-2025.
Company Filing History:
38 out of 1,904 
1 out of 31 Years Active: 2003-2025
Areas of Expertise:
Title: Philip Damberg - Innovator in Microelectronics
Introduction
Philip Damberg is a renowned inventor based in Cupertino, California, recognized for his significant contributions to the field of microelectronics. With a remarkable portfolio of 39 patents, Damberg has established himself as a leading figure in innovative technologies, particularly in package-on-package assembly and microelectronic designs.
Latest Patents
Among his latest inventions is a patent for a "Package-on-package assembly with wire bond vias". This microelectronic package incorporates a substrate with a first surface on which a microelectronic element is placed. The design features electrically conductive elements that are exposed on the substrate's surface, with some connected to the microelectronic element. Notably, the package includes wire bonds secured to the conductive elements, with bases connected to these components and tips that are defined by smaller dimensions than their respective diameters. Additionally, a dielectric encapsulation layer enhances the durability of the wire bonds while leaving certain portions exposed.
Career Highlights
Philip Damberg has made noteworthy strides in his career, contributing to breakthrough technologies at various organizations, including Adeia Semiconductor Bonding Technologies Inc. and Adeia Semiconductor Technologies LLC. His work has not only propelled advancements in microelectronic packaging but has also improved the efficiency and effectiveness of product designs in the tech industry.
Collaborations
Throughout his career, Damberg has collaborated with talented professionals such as Belgacem Haba and Ellis Chau. These partnerships have fostered a productive atmosphere that supports innovative thinking and the successful implementation of complex projects in microelectronics.
Conclusion
Philip Damberg exemplifies the spirit of innovation within the technology sector. With an impressive collection of patents that highlight his expertise in microelectronic packaging, he continues to influence the evolution of technical advancements. His commitment to collaboration and technological development underscores the critical role inventors play in shaping the future of microelectronics.