The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Aug. 14, 2013
Applicant:

Invensas Corporation, San Jose, CA (US);

Inventors:

Ellis Chau, San Jose, CA (US);

Reynaldo Co, Santa Cruz, CA (US);

Roseann Alatorre, San Martin, CA (US);

Philip Damberg, Cupertino, CA (US);

Wei-Shun Wang, Palo Alto, CA (US);

Se Young Yang, Cupertino, CA (US);

Assignee:

Invensas Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 23/433 (2006.01); H01L 25/065 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 23/3677 (2013.01); H01L 23/4334 (2013.01); H01L 23/49517 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 24/06 (2013.01); H01L 24/43 (2013.01); H01L 24/78 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 21/565 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48997 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/851 (2013.01); H01L 2224/8518 (2013.01); H01L 2224/85951 (2013.01); H01L 2224/85986 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1029 (2013.01); H01L 2225/1052 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1088 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/1715 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3511 (2013.01); H05K 3/3436 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10515 (2013.01); Y10T 29/49149 (2015.01); Y10T 29/49151 (2015.01);
Abstract

A structure includes a substrate having a first region and a second region, the substrate also having a first surface and a second surface. Electrically conductive elements are exposed at the first surface within the second region. Wire bonds have bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. At least one of the wire bonds has a shape such that the wire bond defines an axis between the free end and the base thereof and such that the wire bond defines a plane. A bent portion of the at least one wire bond extends away from the axis within the plane. A dielectric encapsulation layer covers portions of the wire bonds such that unencapsulated portions, including the ends, of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer.


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