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For the Inventor, By the Inventor

Unterhaching, Germany

Peter Weigand

This inventor holds 15 USPTO granted patents, primarily in Semiconductor Manufacturing. Top assignees: Siemens Aktiengesellschaft, Kabushiki Kaisha Toshiba, International Business Machines Corporation. Active years: 1998-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Peter Weigand. Retrieved from https://idiyas.com/inventor/peter-weigand

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 15

% Patents Active = 100.0

Average Co-Inventor Count = 2.2

ph-index = 6

Forward Citations = 190(Granted Patents)


Location History:

  • Unterhaching, AT (2000)
  • Unterhaching, DE (1998 - 2001)
  • Croton on Hudson, NY (US) (1998 - 2002)
  • North Croton on Hudson, NY (US) (2002)

Company Filing History:

goldMedal11 out of 30,893 
 
Siemens Aktiengesellschaft
 patents
silverMedal4 out of 53,286 
 
Kabushiki Kaisha Toshiba
 patents
bronzeMedal2 out of 166,425 
 
International Business Machines Corporation
 patents
4. 1 out of 244 
 
Infineon Technologies North America Corp.
 patents
5. 1 out of 19 
 
Siemens Microelectronics Limited
 patents
where one patent can have more than one assignee

Years Active: 1998-2002

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Areas of Expertise:
Integrated Circuits
Semiconductor Processing
Thermal Conductivity
Shallow Trench Isolation
Metal Line Deposition
Microstructure Fabrication
Conductive Structures
Wafer Temperature Measurement
Planarization Techniques
Electrically Blowable Fuses
15 patents (USPTO):Explore Patents
1. 6492282 - Integrated circuits and manufacturing methods (2002-12-10),
2. 6406545 - Semiconductor workpiece processing apparatus and method (2002-06-18),
3. 6252292 - Vertical electrical cavity-fuse (2001-06-26),
4. 6150072 - Method of manufacturing a shallow trench isolation structure for a (2000-11-21),
5. 6136709 - Metal line deposition process (2000-10-24),
6. 6046503 - Metalization system having an enhanced thermal conductivity (2000-04-04),
7. 6015988 - Microstructure and methods for fabricating such structure (2000-01-18),
8. 5992046 - Semiconductor wafer temperature measurement and control thereof using (1999-11-30),
9. 5977635 - Multi-level conductive structure including low capacitance material (1999-11-02),
10. 5963837 - Method of planarizing the semiconductor structure (1999-10-05),
11. 5937541 - Semiconductor wafer temperature measurement and control thereof using (1999-08-17),
12. 5926716 - Method for forming a structure (1999-07-20),
13. 5899736 - Techniques for forming electrically blowable fuses on an integrated (1999-05-04),
14. 5854126 - Method for forming metallization in semiconductor devices with a (1998-12-29),
15. 5851899 - Gapfill and planarization process for shallow trench isolation (1998-12-22),

Title: The Innovative Contributions of Peter Weigand

Introduction

Peter Weigand is a notable inventor based in Unterhaching, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 15 patents. His work focuses on integrated circuits and manufacturing methods, showcasing his expertise and innovative spirit.

Latest Patents

One of Peter Weigand's latest patents involves a method of filling gaps between adjacent gate electrodes of a semiconductor structure. This method utilizes a self-planarizing material that is deposited over the structure. A first portion of this material flows between the gate electrodes to fill the gaps, while a second portion is deposited over the tops of the gate electrodes to create a layer with a substantially planar surface. The inclusion of a phosphorous dopant in the second portion of the self-planarizing material enhances the effectiveness of the gap filling process. This innovation allows for the effective filling of relatively small gaps, resulting in a layer that is suitable for subsequent photolithography.

Another significant patent pertains to a wafer processing apparatus and method. This apparatus includes a processing chamber with a chuck for supporting a wafer and a pedestal spaced apart from the chuck. The apparatus controls the pressure of gas layers to maintain a constant thermal conductivity, thereby optimizing the heat transfer process during wafer processing.

Career Highlights

Throughout his career, Peter Weigand has worked with prominent companies such as Siemens Aktiengesellschaft and Toshiba Corporation. His experience in these organizations has contributed to his extensive knowledge and expertise in semiconductor technologies.

Collaborations

Peter has collaborated with notable professionals in the field, including Dirk Tobben and Naohiro Shoda. These collaborations have further enriched his work and innovations in semiconductor technology.

Conclusion

Peter Weigand's contributions to the field of semiconductor technology through his innovative patents and collaborations highlight his significant role as an inventor. His work continues to influence advancements in integrated circuits and manufacturing methods.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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