The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2000
Filed:
Oct. 06, 1999
Sven Schmidbauer, Dresden, DE;
Stefan J Weber, Fishkill, NY (US);
Peter Weigand, Unterhaching, AT;
Larry Clevenger, LaGrangeville, NY (US);
Roy Iggulden, Newburgh, NY (US);
Infineon Technologies North America Corp., San Jose, CA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for depositing metal lines for semiconductor devices, in accordance with the present invention includes the steps of providing a semiconductor wafer including a dielectric layer formed on the wafer, the dielectric layer having vias formed therein and placing the wafer in a deposition chamber. The method further includes depositing a metal on the wafer to fill the vias wherein the metal depositing is initiated when the wafer is at a first temperature and the depositing is continued while heating the wafer to a target temperature which is greater than the first temperature.