South Salem, NY, United States of America

Perminder S Bindra

This inventor holds 16 USPTO granted patents, primarily in Electronic Manufacturing. Top assignee: International Business Machines Corporation. Active years: 1983-1995.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Perminder S Bindra. Retrieved from https://idiyas.com/inventor/perminder-s-bindra

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 16

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 12

Forward Citations = 747(Granted Patents)

Location History:

Ossining, NY (US) (1983 - 1988)
Johnson City, NY (US) (1990)
Vestal, NY (US) (1990 - 1991)
South Salem, NY (US) (1991 - 1995)

Company Filing History:

16 out of 166,483

International Business Machines Corporation

patents

Years Active: 1983-1995

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Areas of Expertise:

Organic Circuit Boards

Electrical Connection Technology

Multi-Layer Electronics

Dielectric Substrate

Plating Baths

Copper Plating

Electrolytic Cells

Nendritic Materials

Ferric Chloride Etchants

Power Core Alignment

Electrochemical Dispersal

Metal Ion Concentration

16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 5435057 - Interconnection method and structure for organic circuit boards (1995-07-25),

2. 5298685 - Interconnection method and structure for organic circuit boards (1994-03-29),

3. 5229550 - Encapsulated circuitized power core alignment and lamination (1993-07-20),

4. 5185073 - Method of fabricating nendritic materials (1993-02-09),

5. 5137461 - Separable electrical connection technology (1992-08-11),

6. 5129142 - Encapsulated circuitized power core alignment and lamination (1992-07-14),

7. 5048178 - Alignment--registration tool for fabricating multi-layer electronic (1991-09-17),

8. 5035778 - Regeneration of spent ferric chloride etchants (1991-07-30),

9. 4969979 - Direct electroplating of through holes (1990-11-13),

10. 4910049 - Conditioning a dielectric substrate for plating thereon (1990-03-20),

11. 4725339 - Method for monitoring metal ion concentrations in plating baths (1988-02-16),

12. 4540473 - Copper plating bath having increased plating rate, and method (1985-09-10),

13. 4490219 - Method of manufacture employing electrochemically dispersed platinum (1984-12-25),

14. 4479852 - Method for determination of concentration of organic additive in plating (1984-10-30),

15. 4457986 - Use of underpotential deposited layers of metals on foreign metal (1984-07-03),

Title: The Innovative Mind of Perminder S Bindra

Introduction

Perminder S Bindra is a notable inventor based in South Salem, NY (US). He has made significant contributions to the field of technology, holding a total of 16 patents. His work primarily focuses on advancements in organic circuit boards, showcasing his expertise and innovative spirit.

Latest Patents

Among his latest patents is an interconnection method and structure for organic circuit boards. This invention involves polymeric subcomposites of a circuit board that are interconnected by metallic dendrites on electrical contact pads. Notably, the electrical contact pads of one subcomposite are designed to be larger widthwise than those of the other subcomposite. This innovative approach enhances the functionality and efficiency of circuit boards.

Career Highlights

Perminder S Bindra is currently associated with International Business Machines Corporation, commonly known as IBM. His role at IBM allows him to collaborate with some of the brightest minds in the industry, furthering his contributions to technological advancements.

Collaborations

Some of his notable coworkers include David Noel Light and Voya Rista Markovich. Their collaborative efforts contribute to the innovative environment at IBM, fostering creativity and technological breakthroughs.

Conclusion

Perminder S Bindra's work exemplifies the spirit of innovation in technology. His patents and contributions to organic circuit boards reflect his dedication to advancing the field. His collaborations and career at IBM further enhance his impact on the industry.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]