International Business Machines Corporation

Perminder S Bindra

David Noel Light

Voya Rista Markovich

Jaynal Abedin Molla

Allan P David

Paul Alfred Lauro

George Frederick Walker

Jerome J Cuomo

Sung Kwon Kang

Douglas Oliver Powell

Edwin Lorimer Thomas

Anthony P Ingraham

John J Ritsko

Raymond Thomas Galasco

Thomas P Gall

Jeffrey McKeveny

Jungihl Kim

George J Saxenmeyer, Jr

Jack A Varcoe

Robert E Ruane

Ross Downey Havens

Ekkehard F Miersch

Dennis A Canfield

Jonathan David Reid

Donald Francis Canaperi

Bernd Karl Appelt

Jae M Park

Robert Daniel Edwards

James R Loomis

Kathleen L Covert

James R White

Peter J Lueck

Solomon L Levine

Charles E Gasdik

Paul B Pickar

Lisa J Smith

Eberhard H Naegele

Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.

Interconnection method and structure for organic circuit boards

A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.

Encapsulated circuitized power core alignment and lamination

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

Method of fabricating nendritic materials

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

Separable electrical connection technology

Disclosed is a method of forming a multilayer microelectronic circuit package. According to the disclosed method, the first layer of the package has features that are brought into proximity to an optical system which is adapted for imaging a surface of the layer. The optical system images features on the surface of the first layer, and generates targets around selected ones of the features. The, the next layer of the circuit package is brought into proximity to the optical system. This next layer is moved, i.e., translated and rotated, until selected features of the layer coincide with the targets generated through the optical system. This next layer is then placed atop the previous layer. Finally, the layers are laminated to form the multilayer microelectronic circuit package.

Alignment--registration tool for fabricating multi-layer electronic

Spent ferric chloride etching compositions are regenerated by electrolysis which includes introducing spent ferric chloride etching composition containing total iron content substantially equal to the original total iron content of fresh etching composition into the anode compartment of an electrolysis cell that contains an anode compartment, a cathode compartment, and an anion-exchange membrane separating the compartments, and applying voltage of +0.6 to +1.5 volts versus a saturated calomel electrode to the anode.

Regeneration of spent ferric chloride etchants

Substantially nonconductive or semiconductive surfaces of through holes can be electroplated directly, without an intervening non-electrolytic metallization, by a stepwise process which includes the application to the through holes of a polyelectrolyte surfactant in solution in combination with the application of a conductive metal containing material.

Direct electroplating of through holes

A dielectric substrate is conditioned for plating from an electroless metal plating bath by providing the surface or surfaces of the substrate that are to be plated with semiconductor material whereby the semiconductor material, in the case of n-type material, exhibits energy band where the valence band is equal to or higher than and, in the case of p-type material, exhibits energy band where the valence band is equal to or lower than the redox potential of the metallic ions in the electroless plating bath that are to be deposited as metal on the substrate.

Conditioning a dielectric substrate for plating thereon

A rotating disk electrode system operates at constant speed in a solution whose metal ion concentration is held constant at multiple concentrations within a range of concentration. The current at the working electrode is recorded, while the potential at the working electrode is swept at a predetermined rate for each of the concentration values. The diffusion limiting current is determined for each of the concentration values. Then the rotating disk electrode system is operated continuously in a metal plating bath whose metal ion concentration can vary. A voltage applied to the working electrode produces a current at the electrode whose magnitude is compared to the values of the previous calibration to determine the current metal ion concentration. Alternatively, a rotating disk electrode system is operated over a range of speeds in a solution whose ion concentration is held constant over a range of concentration. Current at the working electrode is measured for a given electric potential applied to the working electrode. In this way, a calibration relationship between the current at the electrode and the range of metal ion concentrations is established which can be used with current measured in the plating bath under the same conditions as those that established the calibration curve to predict the concentration of the bath.

Method for monitoring metal ion concentrations in plating baths

A copper plating bath containing a sulfur-containing anion other than sulfate anion and/or a selenium-containing anion other than a selenate anion and/or a tellurium-containing anion other than a tellurate anion in an amount sufficient to increase the plating rate, and method for electroplating copper onto a substrate with the plating bath.

Copper plating bath having increased plating rate, and method

A substrate such as carbon, graphite, or various semiconductors is coated with a 'two-dimensional' thin film form of flat isolated crystallites of platinum, palladium or silver to form a catalyst useful in a fuel cell. The method of formation of the catalyst is to place the substrate in an electrolyte such as H.sub.2 PtCl.sub.6 about 1% and one molar sulfuric acid. The potentiostatic pulse plating method is employed. A high potential pulse of very short duration is followed by a low potential of substantial duration. The very high potential nucleates crystals at various randomly distributed nucleation sites such as imperfections in the surface of the substrate. The resulting catalyst has a large surface area of hexagonal crystals about 20 to 40 Angstroms in diameter.

Method of manufacture employing electrochemically dispersed platinum

The concentration of an organic additive in a plating bath is determined by providing a polished and constant current density preplated rotating disc cathode, a reference electrode and anode in an electrolytic copper plating bath, passing an electric current from the anode to the cathode and reference electrode; measuring the voltage difference between the cathode and reference electrode; and comparing the difference to values for known concentrations of the organic additive.

Method for determination of concentration of organic additive in plating

Fuel cell catalysts which are efficient, long-lived, and refurbishable in-situ include gold carrying a UPD deposit of another element. UPD Ag, Pt, Pd, Ir, Rh or Tl, Pb and Bi on Au crystallites are carried on and bonded to another substrate. The crystallites cause dissociative adsorption of the oxygen molecules so that four electrons are produced per molecule during the reduction reaction which is involved. In an alkaline electrolyte, the catalyst metals such as Pd, Ir, Ag, Rh and Pt show no tendency to poison the counter electrode (counter relative to the other electrode) since each of those metals is a good catalyst for both electrodes. Suitable fuels include methanol (CH.sub.3 OH), formaldehyde (HCHO), and formic acid (HCOOH).

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South Salem, NY, United States of America

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