The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 1991
Filed:
Oct. 23, 1990
Perminder S Bindra, South Salem, NY (US);
Peter J Lueck, Leonberg, DE;
Eberhard H Naegele, Johnson City, NY (US);
International Business Machines Corp., Armonk, NY (US);
Abstract
Disclosed is a method of forming a multilayer microelectronic circuit package. According to the disclosed method, the first layer of the package has features that are brought into proximity to an optical system which is adapted for imaging a surface of the layer. The optical system images features on the surface of the first layer, and generates targets around selected ones of the features. The, the next layer of the circuit package is brought into proximity to the optical system. This next layer is moved, i.e., translated and rotated, until selected features of the layer coincide with the targets generated through the optical system. This next layer is then placed atop the previous layer. Finally, the layers are laminated to form the multilayer microelectronic circuit package.