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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 4540473 B1

PDFFull Text
Date of Patent:
Sep. 10, 1985

Filed:

Nov. 22, 1983

Copper plating bath having increased plating rate, and method

Applicant:
Inventors:

Perminder S Bindra, Ossining, NY (US);

Allan P David, Binghamton, NY (US);

Raymond T Galasco, Binghamton, NY (US);

Charles E Gasdik, Endicott, NY (US);

David N Light, Briarcliff Manor, NY (US);

Paul B Pickar, Vestal, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorney:

Pollock, Vande Sande & Priddy

Primary Examiner:

G L Kaplan

Int. Cl.
CPC ...
C25D / ;
U.S. Cl.
CPC ...
204 / ; 204 44 ;
Abstract

A copper plating bath containing a sulfur-containing anion other than sulfate anion and/or a selenium-containing anion other than a selenate anion and/or a tellurium-containing anion other than a tellurate anion in an amount sufficient to increase the plating rate, and method for electroplating copper onto a substrate with the plating bath.

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Bindra, Perminder. (1985). Copper plating bath having increased plating rate, and method (U.S. Patent No. 4540473). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4540473

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