The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 1993

Filed:

Apr. 29, 1991
Applicant:
Inventors:

Perminder S Bindra, South Salem, NY (US);

Jerome J Cuomo, Lincolndale, NY (US);

Thomas P Gall, Endwell, NY (US);

Anthony P Ingraham, Endicott, NY (US);

Sung K Kang, Chappaqua, NY (US);

Jungihl Kim, Chappaqua, NY (US);

Paul Lauro, Pomona, NY (US);

David N Light, Friendsville, PA (US);

Voya R Markovich, Endwell, NY (US);

Ekkehard F Miersch, Schoenaich, DE;

Jaynal A Molla, Endicott, NY (US);

Douglas O Powell, Endicott, NY (US);

John J Ritsko, Mount Kisco, NY (US);

George J Saxenmeyer, Jr, Apalachin, NY (US);

Jack A Varcoe, Endwell, NY (US);

George F Walker, New York, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ;
U.S. Cl.
CPC ...
205104 ; 205111 ; 205170 ; 205265 ;
Abstract

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.


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