Seoul, South Korea

Jungihl Kim


Average Co-Inventor Count = 7.4

ph-index = 9

Forward Citations = 568(Granted Patents)


Location History:

  • Peeskill, NY (US) (1991)
  • Peekskill, NY (US) (1988 - 1992)
  • Chappaqua, NY (US) (1990 - 1993)
  • Seoul, KR (1994 - 1997)

Company Filing History:


Years Active: 1988-1997

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13 patents (USPTO):

Title: The Innovative Mind of Jungihl Kim

Introduction

Jungihl Kim, an inventive spirit based in Seoul, South Korea, has made a significant impact in the field of materials science and engineering. With a remarkable portfolio of 13 patents, he has been a driving force in advancing adhesive technologies, particularly in multi-level packaging applications. His contributions have set a foundation for new advancements in various electronic and manufacturing sectors.

Latest Patents

Among his latest patents, Jungihl Kim has developed two notable inventions: the adhesive layer in multi-level packaging and organic material as a metal. The first patent describes a multilayer article that comprises a terminally unsaturated adhesive polyimide adhered to a substrate, which enhances the bonding of layers in complex structures. This novel adhesive not only improves adhesion between various materials, such as copper and polymers but also serves a dual function as a diffusion barrier against copper diffusion.

In another embodiment of this patent, the adhesive polyimide layer is applied to electrical circuit components, ensuring reliable electrical connections within devices. The innovative polyimide incorporates unsaturated heterocyclic groups that can either replace traditional aromatic diamines or complement them, creating a versatile adhesive suitable for a wide range of applications.

Career Highlights

Jungihl Kim’s professional journey has been marked by his association with the prestigious International Business Machines Corporation (IBM). Here, he continues to leverage his expertise in materials science to innovate and refine products that meet the increasing demands of modern technology. His work at IBM has positioned him at the forefront of research and development in adhesive materials, making significant contributions to the company’s advancements in electronics.

Collaborations

Throughout his career, Jungihl has collaborated with prominent colleagues including George Frederick Walker and John J. Ritsko. These partnerships have not only facilitated the exchange of ideas and knowledge but have also propelled joint research efforts that have led to groundbreaking innovations in their shared field.

Conclusion

Jungihl Kim’s dedication to innovation and his remarkable portfolio of patents reflect his significant contributions to the field of materials science. His work not only enhances the performance of electronic components but also paves the way for future advancements in multi-level packaging technologies. As he continues to develop new solutions at IBM, Jungihl remains an inspiring figure for aspiring inventors and a key player in the evolution of adhesive technology.

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