The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 1994
Filed:
Dec. 17, 1992
Farid Y Aoude, Wappingers, NY (US);
Emanuel I Cooper, Riverdale, NY (US);
Peter R Duncombe, Peekskill, NY (US);
Shaji Farooq, Hopewell Junction, NY (US);
Edward A Giess, Purdys Station, NY (US);
Young-Ho Kim, Seoul, KR;
Sarah H Knickerbocker, Hopewell Junction, NY (US);
Friedel Muller-Landau, Putnam Valley, NY (US);
Mark O Neisser, Wappingers Falls, NY (US);
Jae M Park, Somers, NY (US);
Robert R Shaw, Poughkeepsie, NY (US);
Robert A Rita, Wappingers Falls, NY (US);
Thomas M Shaw, Peekskill, NY (US);
Rao Vallabhaneni, Wappingers Falls, NY (US);
Jon A Van Hise, Brookfield, CT (US);
George F Walker, New York, NY (US);
Jungihl Kim, Seoul, KR;
James M Brownlow, deceased, late of Norwich, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.