Friedel Muller-Landau

Title: Friedel Muller-Landau: Innovator in Ceramic Circuit Structures

Introduction

Friedel Muller-Landau is a notable inventor based in Putnam Valley, NY (US). He has made significant contributions to the field of ceramic circuit structures, holding a total of 2 patents. His work focuses on improving the reliability and performance of circuitized ceramic substrates.

Latest Patents

Muller-Landau's latest patents include a process for producing ceramic circuit structures that feature conductive vias. These innovations involve improved via-filling compositions designed to create conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without the risk of cracking or loss of hermetic sealing. The compositions consist of pastes that contain a mixture of ceramic and/or glass spheres of uniform diameter, conductive metal particles, and a binder vehicle. The resulting conductive via bodies form a uniform conductive skeletal network of sintered metal particles, which are densely packed within a matrix of co-sintered ceramic and/or glass spheres.

Career Highlights

Friedel Muller-Landau is currently associated with the International Business Machines Corporation (IBM). His work at IBM has allowed him to push the boundaries of technology in the field of ceramics and electronics.

Collaborations

Muller-Landau has collaborated with notable coworkers such as Farid Youssif Aoude and Emanuel Israel Cooper. Their combined expertise has contributed to advancements in the development of ceramic circuit structures.

Conclusion

Friedel Muller-Landau's innovative work in ceramic circuit structures has made a significant impact on the field of electronics. His patents reflect a commitment to enhancing the performance and reliability of circuitized ceramic substrates.