International Business Machines Corporation

Friedel Muller-Landau

Young-Ho Kim

Thomas M Shaw

George Frederick Walker

Emanuel Israel Cooper

Shaji Farooq

Sarah Huffsmith Knickerbocker

Robert Anthony Rita

Rao Venkateswara Vallabhaneni

Peter Richard Duncombe

Jae M Park

Jungihl Kim

Robert R Shaw

Mark O Neisser

Farid Youssif Aoude

Edward A Giess

Jon A Van Hise

James M Brownlow, Deceased

Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Process for producing ceramic circuit structures having conductive vias

Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Via paste compositions and use thereof to form conductive vias in

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Friedel Muller-Landau