Shanghai, China

Peng Wei

USPTO Granted Patents = 11 

 

Average Co-Inventor Count = 6.1

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2016-2025

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11 patents (USPTO):

Title: Peng Wei: Innovator in Thermally Conductive Materials

Introduction

Peng Wei, an esteemed inventor based in Shanghai, China, has made significant contributions to the field of thermally conductive materials. With a portfolio of 10 patents, Peng showcases a commitment to innovation and the advancement of materials science.

Latest Patents

Among his latest innovations are two noteworthy patents concerning silicone compositions. The first patent details a highly thermally conductive flowable silicone composition, which includes a polyorganosiloxane component combined with specialized thermally conductive fillers. This unique formulation features aluminum oxide and aluminum nitride particles of varying sizes, specifically designed to optimize thermal conductivity.

In addition, Peng has developed a non-curable thermally conductive pituitous silicone material. This composition predominantly consists of a non-functional non-crosslinked organosiloxane fluid combined with a carefully selected hydrosilylation reaction product. The incorporation of various thermally conductive fillers significantly enhances its thermal performance, making it ideal for advanced applications.

Career Highlights

Peng Wei's professional journey includes tenure at reputable firms, notably Dow Silicones Corporation and RDA Microelectronics Technologies (Shanghai) Co., Ltd. Throughout his career, he has focused on developing innovative materials that push the boundaries of technology and engineering.

Collaborations

Throughout his career, Peng Wei has collaborated with talented individuals, including Yan Zheng and Yu Wang. These partnerships have contributed to the refinement and implementation of his innovative solutions, reflecting the importance of teamwork in the field of research and development.

Conclusion

Peng Wei stands out as a prominent figure in the development of thermally conductive materials. His recent patents highlight a deep understanding of material science and an unwavering dedication to innovation. With a solid foundation in both collaborative efforts and individual achievements, Peng continues to shape the future of thermal management solutions.

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