The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Sep. 29, 2017
Applicant:
Dow Silicones Corporation, Midland, MI (US);
Inventors:
Zhihua Liu, Shanghai, CN;
Peng Wei, Shanghai, CN;
Hexiang Yan, Shanghai, CN;
Yi Zhao, Shanghai, CN;
Qi Chen, Songjiang, CN;
Junmin Zhu, Shanghai, CN;
Assignee:
Dow Silicones Corporation, Midland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); C08K 3/013 (2018.01); C08G 77/12 (2006.01); C08G 77/18 (2006.01); C08G 77/20 (2006.01); C08G 77/00 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C08G 77/12 (2013.01); C08G 77/18 (2013.01); C08G 77/20 (2013.01); C08G 77/70 (2013.01); C08K 3/013 (2018.01); C08K 3/36 (2013.01); C08K 2201/001 (2013.01);
Abstract
Provided are a composition, a cured polymer material formed from said composition, a method for forming a thermally conductive material on an article and an article having a thermally conductive material. Said thermally conductive material can be formed on an electronic device, and can be peeled off from said electronic device.