Dow Silicones Corporation

Rda Microelectronics Technologies (shanghai) Co., Ltd.

The Procter Gamble Company

Dow Global Technolgoies LLC

Petrochina Company Limited

Celestica Technology Consultancy (shanghai) Co. Ltd

East China University of Science

Peng Wei

Yan Zheng

Dorab Edul Bhagwagar

Qianqing Ge

Yu Wang

Lei Huang

Zhanjie Li

Junmin Zhu

Mingfang Pan

Xingpeng Zhao

Wei Huang

Hongyu Chen

Ross Strand

Yali Wang

Libo Wang

Chao He

Qi Chen

Zhihua Liu

Min Liu

Yunming Shi

Qian Chen

Chinghwa Yu

Sheng Xu

Qinghua Yu

Jiguang Zhang

Yi Zhao

Sihan Wang

Fengyi Su

Yaoyin Fan

Buwei Yu

Fuling Huang

Xiuhui Wang

Baojun Zhang

Guizhi Wang

Deshun Zhang

Debo Hong

Jianzhong Li

Shukun Sun

Xuemei Han

Hexiang Yan

Gang Wang

Xuedong Gao

Xiangyu Wang

Jiabo Qu

Tao Yi

Danhuan Ma

FengFeng Xue

Shihui Hong

Puke Mi

Cassie Hale

Jinhua Qian

Panfeng Lu

Haifeng Zhai

Bixiang Hu

Yuxin Gao

Ling Jiang

Yinzheng Zhou

Wenhua Fan

Lingting Fan

Guiyue Guo

Hanguang Wu

Provided is a thermal interface material containing a divinyl polydimethylsiloxane, a chain extender, a crosslinker, 80 volume-percent or more thermally conductive filler, treating agent composition, platinum hydrosilylation catalyst, and up to 0.2 weight-percent hydrosilylation inhibitor; where the wherein weight-percent values are relative to thermal interface material composition weight, volume-percent values are relative to thermal interface material composition volume, the molar ratio of silyl hydride groups to vinyl groups in the thermal interface material composition is 0.4 or more and at the same time is 1.0 or less, and the molar ratio of silyl hydride functionality from the chain extender to silyl hydride functionality from the crosslinker is 13 or more and at the same time 70 or less.

Thermal interface material with low dispensing viscosity, low vertical flow after dispensing, and low thermal impedance after cure

A composition contains: (a) a polyorganosiloxane component comprising one or a combination of more than one poly-organosiloxane; (b) a filler treating agent comprising alkyltrialkoxysilane and trialkoxysiloxy-terminated diorganopolysiloxane; (c) 90-98 weight-percent of a combination of thermally conductive fillers comprising: (i) 25-40 weight-percent of thermally conductive filler particles having an average particle size of 70-150 micrometers and selected from one or a combination of aluminum oxide and aluminum nitride particles; (ii) 15-30 weight-percent thermally conductive filler particles having an average particle size in a range of 30-45 micrometers selected from one or a combination of aluminum oxide and aluminum nitride particles; (iii) 25-32 weight-percent aluminum oxide particles having an average particle size in a range of 1-5 micrometers; and (iv) 10-15 weight-percent thermally conductive filler particles having an average particle size in a range of 0.1 to 0.5 micrometers; where weight-percent is relative to composition weight.

Highly thermally conductive flowable silicone composition

A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.

Non-curable thermally conductive pituitous silicone material

A composition contains an organopolysiloxane having the average chemical structure (I):[R'RSiO&#x2014;(RSiO)]&#x2014;Si&#x2014;[OSiR]&#x2014;Y&#x2014;Si(OR)&#x2003;&#x2003;(I)where: R is independently in each occurrence selected from alkyl, aryl, substituted alkyl and substituted alkyl groups having from one to 8 carbon atoms; R&#x2032; is independently in each occurrence selected from R and terminally unsaturated alkylene groups having from 2 to 6 carbon atoms; Y is selected from a group consisting of: X, and X&#x2014;(RSiO)SiR&#x2014;X; where p has an average value in a range of one to 3; and X is independently in each occurrence selected from alkylene and substituted alkylene groups having from one to 6 carbon atoms; and the average values for subscripts m and n are each greater than zero and independently selected so that the average value for the sum of all of the average m values and the average n value is in a range of 30-200.

Trialkoxy functional branched siloxane compositions

A communication method, a communication device, and a readable storage medium, wherein the communication method includes: establishing a communication connection with a data source device; establishing a second wired connection with at least one other device; and exchanging identification information with the at least one other device through the second wired connection, thereby the at least one other device receiving communication data sent from the data source device according to the received identification information. With the above method, multi-device communication is performed quickly and reliably.

Method and device for communication, and readable storage medium

A method and an apparatus for Bluetooth connection are disclosed. A first Bluetooth connection can be established between a first node of multiple data receiving nodes and a data source, the multiple data receiving nodes can share a data packet transmitted by the data source via the first Bluetooth connection, and a second node can be selected according to a preset rule from among the multiple data receiving nodes to feed back a response signal to the data source. In a method and an apparatus, the multiple data receiving nodes can be regarded as a whole, which share a data packet transmitted from the data source and jointly maintain the first Bluetooth connection, and only one of the multiple data receiving nodes is selected to feed back a response signal. Conforming to Bluetooth communication protocols, a method and an apparatus can meet the demanding requirements on hardware resources of a Bluetooth connection among a data source and multiple data receiving nodes. A one-to-many Bluetooth connection can be realized which saves power consumption without additionally upgrading the data source.

Bluetooth connection method and device

A method for forming thermally conductive composition on electronic components comprises three steps, (I) preparing a silicone composition comprising (A) a polyorganosiloxane, (B) a thermally conductive filler and (C) a catalyst, (II) applying the silicone composition on an electronic component of electronic devices, the electronic component generates heat when the electronic devices are working and (III) curing the silicone composition by heat generated by the electronic component.

Method for applying thermally conductive composition on electronic components

Provided are a composition, a cured polymer material formed from said composition, a method for forming a thermally conductive material on an article and an article having a thermally conductive material. Said thermally conductive material can be formed on an electronic device, and can be peeled off from said electronic device.

Thermally conductive composition

Methylene blue (MB) derivatives selectively detect Fby desilylation reaction to act as a fluorescent probe.

Fluoride fluorescence probe

A liquid cooling device, which is used for performing heat dissipation to switching chips and optical modules in the electronic device, and comprises: a first cooling plate attached to the switching chip and used for performing heat dissipation to the switching chip; a second cooling plate attached to the optical module and used for performing heat dissipation to the optical module; an air-liquid heat exchanger used for containing cooling liquid and performing cooling to backflow cooling liquid through cooling air; a transmission pipe used for sequentially transmitting the cooling liquid flowing out from the air-liquid heat exchanger to the first cooling plate and the second cooling plate, which then flows back to the air-liquid heat exchanger; and a power device used for controlling the cooling liquid in the transmission pipe to be sequentially transmitted to the first cooling plate and the second plate and then flow back.

Liquid cooling device and electronic device applying the liquid cooling device

A method for synthesis of 1-decene oligomer is provided, wherein 1-decene is polymerized at 80-120&#xb0; C., 0.8-1.4 MPa in the presence of aluminum trichloride catalyst supported on gamma-alumina and n-hexane solvent where the volume ratio of 1-decene to n-hexane is 3:8-4:1. The catalyst is treated as follows: impregnating gamma-alumina carrier in 0.5-2.0 M of hydrochloric acid, sulfuric acid, nitric acid or mixtures thereof, then vacuum drying at 80-100&#xb0; C. and calcining at 400-800&#xb0; C.; dissolving 5-10 g of anhydrous aluminum trichloride in 100 ml of tetrachloromethane, trichloromethane or dichloromethane solvent; adding the obtained solution into 10-20 g of activated alumina carrier and obtaining the catalyst after vacuum drying. The conversion of 1-decene is 50 wt % or more. The oligomer has a kinematic viscosity at 40&#xb0; C. of 6.0-25 mm/s and a viscosity index of 160-262.

Method for synthesis of 1-decene oligomer

Growing community of inventors

Shanghai, China

Peng Wei