The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Jan. 11, 2018
Applicant:

Dow Silicones Corporation, Midland, MI (US);

Inventors:

Peng Wei, Shanghai, CN;

Fengyi Su, Shanghai, CN;

Yan Zheng, Shanghai, CN;

Dorab Bhagwagar, Saginaw, MI (US);

Debo Hong, Shanghai, CN;

Danhuan Ma, Shanghai, CN;

Junmin Zhu, Shanghai, CN;

Assignee:

Dow Silicones Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/06 (2006.01); C08K 3/22 (2006.01); H05K 7/20 (2006.01); C08L 83/04 (2006.01); C08K 5/56 (2006.01);
U.S. Cl.
CPC ...
C08L 83/06 (2013.01); C08K 3/22 (2013.01); C08L 83/04 (2013.01); H05K 7/20481 (2013.01); C08K 5/56 (2013.01);
Abstract

A method for forming thermally conductive composition on electronic components comprises three steps, (I) preparing a silicone composition comprising (A) a polyorganosiloxane, (B) a thermally conductive filler and (C) a catalyst, (II) applying the silicone composition on an electronic component of electronic devices, the electronic component generates heat when the electronic devices are working and (III) curing the silicone composition by heat generated by the electronic component.


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