Shanghai, China

Danhuan Ma

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Dow Silicones Corporation. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Danhuan Ma. Retrieved from https://idiyas.com/inventor/danhuan-ma

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

 

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Danhuan Ma

Introduction

Danhuan Ma is a notable inventor based in Shanghai, China. He has made significant contributions to the field of electronics through his innovative patent. His work focuses on enhancing the performance and efficiency of electronic components.

Latest Patents

Danhuan Ma holds a patent for a "Method for applying thermally conductive composition on electronic components." This method involves three key steps: preparing a silicone composition that includes a polyorganosiloxane, a thermally conductive filler, and a catalyst; applying this silicone composition to electronic components that generate heat during operation; and curing the silicone composition using the heat produced by the electronic components. This invention is crucial for improving thermal management in electronic devices.

Career Highlights

Danhuan Ma is currently employed at Dow Silicones Corporation, where he continues to develop innovative solutions for the electronics industry. His expertise in thermally conductive materials has positioned him as a valuable asset in his field.

Collaborations

Danhuan Ma collaborates with talented colleagues, including Peng Wei and Fengyi Su, who contribute to the advancement of their projects and innovations.

Conclusion

Danhuan Ma's work exemplifies the spirit of innovation in the electronics sector. His patent for a thermally conductive composition demonstrates his commitment to enhancing electronic component performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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