The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Nov. 10, 2020
Applicant:

Dow Silicones Corporation, Midland, MI (US);

Inventors:

Yan Zheng, Shanghai, CN;

Dorab Bhagwagar, Saginaw, MI (US);

Darren Hansen, Auburn, MI (US);

Peng Wei, Shanghai, CN;

Han Guang Wu, Shanghai, CN;

Assignee:

Dow Silicones Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 5/5419 (2006.01); C08K 7/18 (2006.01); C08K 13/04 (2006.01); C08L 83/04 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 13/04 (2013.01); C08L 83/04 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2296 (2013.01); C08K 2003/282 (2013.01); C08K 5/5419 (2013.01); C08K 7/18 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08K 2201/019 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2312/00 (2013.01);
Abstract

A composition contains: (a) curable silicone composition including: (i) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane with a viscosity of 30 to 400 mPa*s; (ii) a SiH functional crosslinker; and (iii) a hydrosilylation catalyst; where the molar ratio of crosslinker SiH functionality to vinyl functionality is 0.5:1 to 1:1; (b) alkyl trialkoxysilane and/or a mono-trialkoxysiloxy terminated dimethylpolysiloxane treating agent; (c) filler mix containing: (i) 40 wt % or more of spherical and irregular shaped AlN particles, both having an average size of 30 micrometers or more, the spherical AlN fillers are 40-60 wt % of the weight of the AlN fillers; (ii) 25-35 wt % spherical AlOparticles with an average size of 1-5 micrometers; (iii) 10-15 wt % of additional thermally conductive filler with a 0.1-0.5 micrometer average size; and (iv) optionally, BN fillers having an average size greater than 20 micrometers; where filler mix is 90-97 wt % and wt % is relative to composition weight unless otherwise stated.


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