This inventor holds 16 USPTO granted patents and 2 published patent applications and 2 EPO patents. Top assignee: Delta Electronics, Inc.. Active years: 2014-2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Taoyuan Hsien, TW (2014 - 2016)
- Kuei San, TW (2020)
- Taoyuan, TW (2016 - 2022)
Company Filing History:
Years Active: 2014-2022
Title: **Peng-Hsin Lee: A Pioneer in Semiconductor Packaging Innovations**
Introduction
Peng-Hsin Lee is a distinguished inventor based in Taoyuan, Taiwan, renowned for his significant contributions to the field of semiconductor packaging. With an impressive portfolio of 16 patents, Lee is recognized for his innovative approaches that enhance the efficiency and functionality of electronic components.
Latest Patents
Among his latest patents are notable innovations in package structures. One such invention details a package structure that includes a leadframe with distinct portions. The design features a first portion comprising a base part with multiple extended parts, and a second portion with a similar configuration. These extended parts alternate, allowing a chip to be positioned strategically on parts of both sections, enhancing performance. Additionally, another important patent introduces a semiconductor device integrating a substrate with layered conductive circuits, effectively bridging the functionalities of various components through well-structured extension parts.
Career Highlights
Peng-Hsin Lee's career is marked by his role at Delta Electronics, Inc., a renowned leader in the field of electronics. His dedication to research and development has resulted in numerous innovations that leverage advanced packaging techniques, which are vital for modern electronics.
Collaborations
Throughout his career, Peng-Hsin Lee has collaborated with notable colleagues, including Hsin-Chang Tsai and Chia-Yen Lee. These collaborations have played a crucial role in fostering an environment of creativity and innovation, leading to groundbreaking advancements in semiconductor technology.
Conclusion
As an inventor, Peng-Hsin Lee continues to push the boundaries of technology through his innovative patents and groundbreaking work in semiconductor packaging. His contributions not only reflect his expertise but also drive the evolution of electronic components in an increasingly technology-driven world.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile