The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Apr. 29, 2016
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Hsin-Chang Tsai, Taoyuan, TW;

Chia-Yen Lee, Taoyuan, TW;

Peng-Hsin Lee, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/498 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); B32B 37/12 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/49844 (2013.01); H01L 23/49861 (2013.01); B32B 2307/202 (2013.01);
Abstract

A power module package is provided, including a substrate, a first chip, and a second chip. The substrate includes a metal carrier, a patterned insulation layer disposed on the metal carrier and partially covering the metal carrier, and a patterned conductive layer disposed on the patterned insulation layer. The first chip is disposed on the metal carrier not covered by the patterned insulation layer. The second chip is disposed on the patterned conductive layer and electrically connected to the first chip.


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