The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Oct. 03, 2016
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Hsin-Chang Tsai, Taoyuan, TW;

Peng-Hsin Lee, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 23/3107 (2013.01); H01L 23/49524 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 23/49575 (2013.01); H01L 24/73 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 2224/0237 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/73255 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract

A package structure is provided. The package structure includes a leadframe including a plurality of connection portions; a device including a substrate, an active layer disposed on the substrate and a plurality of electrodes disposed on the active layer, wherein the electrodes of the device are connected to the connection portions of the leadframe; a conductive unit having a first side and a second side, wherein the first side of the conductive unit connects to the substrate of the device and the conductive unit connects to at least one of the connection portions of the leadframe; and an encapsulation material covering the device and the leadframe, wherein the second side of the conductive unit is exposed from the encapsulation material.


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