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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10424508 B1

PDFFull Text
Date of Patent:
Sep. 24, 2019

Filed:

Jun. 24, 2015

Interconnection structure having a via structure and fabrication thereof

Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Hsin-Chang Tsai, Taoyuan, TW;

Peng-Hsin Lee, Taoyuan, TW;

Assignee:

Delta Electronics, inc., Taoyuan Hsien, TW;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Herve-Louis Y Assouman

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/288 (2006.01); H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 21/268 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/268 (2013.01); H01L 21/2885 (2013.01); H01L 21/76834 (2013.01); H01L 21/76879 (2013.01); H01L 21/76895 (2013.01); H01L 23/481 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/05 (2013.01); H01L 24/91 (2013.01); H01L 25/074 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 24/03 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0332 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16147 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73255 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/13064 (2013.01);
Abstract

A method of forming an interconnection structure is disclosed, including providing a substrate having a first side and a second side opposite to the first side, forming a via hole through the substrate, wherein the via hole has a first opening in the first side and a second opening in the second side, forming a first pad covering the first opening, and forming a via structure in the via hole subsequent to forming the first pad, wherein the via structure includes a conductive material and is adjoined to the first pad.

Find Patent Forward Citations

Tsai, Hsin-Chang. (2019). Interconnection structure having a via structure and fabrication thereof (U.S. Patent No. 10424508). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10424508

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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