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For the Inventor, By the Inventor

Austin, TX, United States of America

Paul T Lin

USPTO Granted Patents = 37 

Average Co-Inventor Count = 1.5

ph-index = 27

Forward Citations = 4,253(Granted Patents)


Location History:

  • Austin, TX (US) (1983 - 1996)
  • Dallas, TX (US) (2008 - 2010)
  • Chino, CA (US) (2016)

Company Filing History:

goldMedal33 out of 20,290 
 
Motorola Corporation
 patents
silverMedal3 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 1983-2016

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37 patents (USPTO):Explore Patents
1. D763552 - Cap with changeable brim and snap fastener covers (2016-08-16),
2. 7667338 - Package with solder-filled via holes in molding layers (2010-02-23),
3. 7408253 - Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density (2008-08-05),
4. 5508556 - Leaded semiconductor device having accessible power supply pad terminals (1996-04-16),
5. 5468999 - Liquid encapsulated ball grid array semiconductor device with fine pitch (1995-11-21),
6. 5450283 - Thermally enhanced semiconductor device having exposed backside and (1995-09-12),
7. 5436203 - Shielded liquid encapsulated semiconductor device and method for making (1995-07-25),
8. 5378657 - Method for making an aluminum clad leadframe and a semiconductor device (1995-01-03),
9. 5329159 - Semiconductor device employing an aluminum clad leadframe (1994-07-12),
10. 5329158 - Surface mountable semiconductor device having self loaded solder joints (1994-07-12),
11. 5300187 - Method of removing contaminants (1994-04-05),
12. 5280193 - Repairable semiconductor multi-package module having individualized (1994-01-18),
13. 5273938 - Method for attaching conductive traces to plural, stacked, encapsulated (1993-12-28),
14. 5258648 - Composite flip chip semiconductor device with an interposer having test (1993-11-02),
15. 5247423 - Stacking three dimensional leadless multi-chip module and method for (1993-09-21),

Title: The Innovations of Paul T Lin: Pioneering Semiconductor Technology

Introduction: Paul T Lin is an accomplished inventor based in Austin, TX, with an impressive portfolio of 34 patents. His work primarily focuses on semiconductor devices, contributing significantly to advancements in this critical field.

Latest Patents: Among his latest inventions, Lin has developed a leaded semiconductor device featuring accessible power supply pad terminals. This innovation allows for improved connections between the semiconductor die and power supply, enhancing overall efficiency. Additionally, he has designed a liquid encapsulated ball grid array semiconductor device with fine pitch. This device showcases advanced wiring techniques and the integration of liquid encapsulant for better protection and performance.

Career Highlights: Throughout his career, Paul T Lin has worked with prominent companies, including Motorola Corporation. His expertise in semiconductor technology has made his patents significant contributions to the industry, showcasing his ability to solve complex engineering challenges.

Collaborations: Lin has had the opportunity to collaborate with notable professionals in the field, such as Michael B McShane and Howard P Wilson. These collaborations have undoubtedly enriched his work and extended his impact on semiconductor innovations.

Conclusion: Paul T Lin’s contributions to semiconductor technology through his innovative patents have established him as a key figure in the industry. His latest inventions exhibit not only his technical prowess but also his commitment to advancing technology for practical applications.

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