The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 1995
Filed:
Jan. 10, 1994
Paul T Lin, Austin, TX (US);
Michael B McShane, Austin, TX (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A thermally enhanced semiconductor device (10) having an exposed backside (22) is described. In one embodiment, a PC board substrate (12) is provided having a pattern of conductive traces (14) on both upper and lower surfaces of the substrate. Electrical continuity is maintained between the two surfaces with conductive vias (16). A semiconductor die (18) is flip-mounted to the upper surface of the substrate. Solder bumps (26) electrically connect the die to the conductive traces, and an underfill (28) couples the active side (20) of the die to the upper surface of the substrate. A package body (40) is formed around the perimeter (24) of the die leaving the inactive backside exposed for enhanced thermal dissipation. The inactive backside can also be coupled to a heat sink for increased thermal dissipation. A plurality of solder balls (42) electrically connected to the conductive traces is attached to the lower surface of the substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile