The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2010
Filed:
Jul. 23, 2007
Paul T. Lin, Dallas, TX (US);
Chi-shih Chang, Austin, TX (US);
Paul T. Lin, Dallas, TX (US);
Chi-Shih Chang, Austin, TX (US);
Other;
Abstract
The present invention discloses an electronic package to contain and protect an integrated circuit (IC) chip. The electronic package further includes a leadframe, a flexible circuit or PCB type of substrate. The leadframe, flexible circuit or PCB type substrate further includes solder contacts, which are aligned with via holes in the molding layers on the top and bottom sides of the package. These via holes are for placing solder paste or solder balls from above and below for electrical access to the IC chip. These solder balls provide access for electrical testing after the package is mounted on a motherboard. They also provide the connection points for stacking multiple packages vertically.