This inventor holds 7 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2004-2008.
Company Filing History:
Years Active: 2004-2008
Title: Paul McGregor: Innovator in Copper Electroplating Technologies
Introduction
Paul McGregor is a notable inventor based in Hillsboro, OR (US), recognized for his contributions to the field of electroplating and semiconductor technologies. With a total of 7 patents to his name, McGregor has made significant advancements that enhance the performance and reliability of electronic components.
Latest Patents
One of McGregor's latest patents is titled "Method of copper electroplating to improve gapfill." This invention provides a copper electroplating bath composition and a method that includes an aqueous electroplating composition containing copper, at least one acid, and various additives. The method involves contacting a substrate with the plating composition and applying a multi-step waveform potential to improve the electroplating process. Another significant patent is "Copper alloys for interconnections having improved electromigration characteristics and methods of making same." This patent details the formation of copper alloy interconnect lines on integrated circuits by introducing dopant elements into a copper layer, thereby enhancing electromigration resistance and adhesion characteristics.
Career Highlights
Paul McGregor is currently employed at Intel Corporation, where he applies his expertise in electroplating and semiconductor technologies. His work focuses on developing innovative solutions that improve the manufacturing processes of electronic components.
Collaborations
Throughout his career, McGregor has collaborated with esteemed colleagues such as Thomas N. Marieb and Carolyn Block, contributing to various projects that push the boundaries of technology in the semiconductor industry.
Conclusion
Paul McGregor's innovative work in copper electroplating and semiconductor technologies has made a lasting impact on the industry. His patents reflect a commitment to enhancing the performance and reliability of electronic components, solidifying his reputation as a leading inventor in his field.