Arnad, Italy

Paolo Schina



 

Average Co-Inventor Count = 3.5

ph-index = 2

Forward Citations = 5(Granted Patents)


Location History:

  • Arnad, IT (2011 - 2018)
  • Turin, IT (2019 - 2024)

Company Filing History:


Years Active: 2011-2024

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10 patents (USPTO):Explore Patents

Title: Innovations of Paolo Schina in Thermal Inkjet Technology

Introduction

Paolo Schina is a notable inventor based in Arnad, Italy, recognized for his contributions to thermal inkjet technology. With a total of 10 patents to his name, Schina has made significant advancements in the field of printing technology, particularly through his innovative designs and methods.

Latest Patents

Among his latest patents, Schina has developed a thermal inkjet printhead and a printing assembly that incorporates this printhead. The thermal inkjet printhead features a substrate, a nozzle layer with multiple nozzles, and corresponding ink ejection chambers. Each chamber contains heater resistors that facilitate ink drop ejection by heating, enhancing the reliability of the printhead and improving manufacturing yield. Additionally, he has proposed a method for forming a thermal inkjet printhead, which includes steps for utilizing a semiconductor wafer with an integrated electronic circuit. This method aims to streamline the production process of thermal inkjet printheads.

Career Highlights

Throughout his career, Schina has worked with prominent companies such as Sicpa Holding SA and Telecom Italia S.p.A. His experience in these organizations has contributed to his expertise in the development of innovative printing technologies.

Collaborations

Schina has collaborated with talented individuals in his field, including Silvia Baldi and Lucia Giovanola. These partnerships have likely fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Paolo Schina's work in thermal inkjet technology exemplifies the impact of innovation in the printing industry. His patents and career achievements highlight his commitment to enhancing printhead reliability and manufacturing processes.

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