The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

Dec. 16, 2015
Applicant:

Sicpa Holding SA, Prilly, CH;

Inventors:

Silvia Baldi, Arnad, IT;

Danilo Bich, Arnad, IT;

Lucia Giovanola, Arnad, IT;

Anna Merialdo, Arnad, IT;

Paolo Schina, Arnad, IT;

Assignee:

SICPA HOLDINGS SA, Prilly, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/162 (2013.01); B41J 2/1433 (2013.01); B41J 2/1603 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B41J 2/1632 (2013.01); B41J 2/1635 (2013.01); B41J 2002/14411 (2013.01); B41J 2002/14475 (2013.01);
Abstract

A method of manufacturing an ink jet printhead includes: providing a silicon substrate including active ejecting elements; providing a hydraulic structure layer; providing a silicon orifice plate having a plurality of nozzles for ejection of the ink; and assembling the silicon substrate with the hydraulic structure layer and the silicon orifice plate. Providing the silicon orifice plate includes: providing a silicon wafer having a substantially planar extension delimited by a first and a second surfaces; performing a thinning at the second surface so as to remove a central portion having a preset height; and forming in the silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of the ink.


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