Method of manufacturing an ink-jet printhead

Abstract

The present application relates to a method of manufacturing an ink-jet printhead comprising: providing a silicon substrate () including active ejecting elements (); providing a hydraulic structure layer () for defining hydraulic circuits configured to enable a guided flow of ink; providing a silicon orifice plate () having a plurality of nozzles () for ejection of the ink; assembling the silicon substrate () with the hydraulic structure layer () and the silicon orifice plate (); wherein providing the silicon orifice plate () comprises: providing a silicon wafer () having a planar extension delimited by a first surface () and a second surface () on opposite sides of the silicon wafer (); performing a thinning step at the second surface () so as to remove from the second surface () a central portion () having a preset height (H), the silicon wafer () being formed, following the thinning step, by a base portion () having a planar extension and a peripheral portion () extending from the base portion (), transversally with respect to the planar extension of the base portion (); and forming in the silicon wafer () a plurality of through holes, each defining a respective nozzle () for ejection of the ink. The method according to the present invention is characterized in that the silicon wafer () is a silicon-on-insulator wafer, wherein the silicon-on-insulator wafer comprises a silicon device layer () adjacent to the first surface (), a silicon handle layer () adjacent to the second surface () and an insulator layer () in-between.