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For the Inventor, By the Inventor

Killaloe, Ireland

Oliver J Kierse

This inventor holds 23 USPTO granted patents and 1 published patent application and 5 EPO patents, primarily in Integrated Circuit Packaging. Top assignees: Analog Devices,inc., Analog Devices Global, Analog Devices International Unlimited Company. Active years: 1996-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Oliver J Kierse. Retrieved from https://idiyas.com/inventor/oliver-j-kierse

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 91.3

 

Average Co-Inventor Count = 2.1

ph-index = 8

Forward Citations = 195(Granted Patents)


Location History:

  • Clare County, IE (1996)
  • County Clare, IE (1996 - 2011)
  • Co Clare, IE (2008 - 2011)
  • Ballina, IE (2011)
  • Killaloe, IE (1998 - 2024)

Company Filing History:

goldMedal16 out of 3,699 
 
Analog Devices,inc.
 patents
silverMedal3 out of 373 
 
Analog Devices Global
 patents
bronzeMedal3 out of 719 
 
Analog Devices International Unlimited Company
 patents
4. 1 out of 118 
 
Analog Devices Global Unlimited Company
 patents

Years Active: 1996-2026

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Areas of Expertise:
Integrated Circuit
Packaging
Stress Shield
Gas Sensor
Thermal Management
Capacitive Sensor
Radiation Sensor
Wafer Level CSP
EMF Shielding
Localized Strain Relief
Die Paddle
Component Structure
23 patents (USPTO):Explore Patents
1. 12538804 - Integrated circuit packages to minimize stress on a semiconductor die (2026-01-27),
2. 12027472 - Integrated circuit packages to minimize stress on a semiconductor die (2024-07-02),
3. 11616027 - Integrated circuit packages to minimize stress on a semiconductor die (2023-03-28),
4. 10730743 - Gas sensor packages (2020-08-04),
5. 10461151 - Localized strain relief for an integrated circuit (2019-10-29),
6. 9786609 - Stress shield for integrated circuit package (2017-10-10),
7. 9661408 - Packages and methods for packaging (2017-05-23),
8. 9466666 - Localized strain relief for an integrated circuit (2016-10-11),
9. 9156680 - Packages and methods for packaging (2015-10-13),
10. 8890301 - Packaging and methods for packaging (2014-11-18),
11. 8766186 - Control aperture for an IR sensor (2014-07-01),
12. 8476591 - Radiation sensor device and method (2013-07-02),
13. 8193620 - Integrated circuit package with enlarged die paddle (2012-06-05),
14. 7939916 - Wafer level CSP packaging concept (2011-05-10),
15. 7938014 - Sealed capacitive sensor (2011-05-10),

Title: Inventor Oliver J Kierse - Revolutionizing Technology in Killaloe, IE

Introduction: Oliver J Kierse is a visionary inventor based in Killaloe, Ireland, known for his groundbreaking contributions to the field of technology.

Latest Patents: Oliver J Kierse holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his innovative spirit and commitment to creating a better future.

Career Highlights: With a career spanning over two decades, Oliver J Kierse has worked with leading tech companies to develop cutting-edge solutions that have revolutionized industries and improved the lives of many.

Collaborations: Throughout his career, Oliver J Kierse has collaborated with top researchers, engineers, and scientists, fostering a culture of innovation and excellence in all his projects.

Conclusion: Oliver J Kierse's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology in Killaloe and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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