The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Feb. 20, 2023
Analog Devices International Unlimited Company, Limerick, IE;
Ramji Sitaraman Lakshmanan, Limerick, IE;
Bernard Stenson, Upper Manister, IE;
Padraig Liam Fitzgerald, Mallow, IE;
Oliver Kierse, Killaloe, IE;
Michael James Twohig, County Cork, IE;
Michael John Flynn, Waterford, IE;
Laurence Brendan O'Sullivan, Limerick, IE;
Analog Devices International Unlimited Company, Limerick, IE;
Abstract
An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.