Limerick, Ireland

Ramji Lakshmanan

This inventor holds 6 USPTO granted patents and 3 published patent applications and 1 EPO patent. Top assignee: Analog Devices International Unlimited Company. Active years: 2021-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ramji Lakshmanan. Retrieved from https://idiyas.com/inventor/ramji-lakshmanan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 100.0

 

Average Co-Inventor Count = 5.9

ph-index = 2

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2021-2026

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6 patents (USPTO):Explore Patents

Title: Innovations of Ramji Lakshmanan

Introduction

Ramji Lakshmanan is a notable inventor based in Limerick, Ireland. He has made significant contributions to the field of microfabrication and integrated circuit technology. With a total of five patents to his name, his work has had a considerable impact on various applications in chemical and biological reactions.

Latest Patents

One of his latest patents is for a thermal platform and a method of fabricating it. This microfabricated thermal platform can be formed over a substrate, such as a silicon wafer. The substrate is coated in a thermally-insulating material, which may be an organic polymer like polyimide or SUS. The surface of the thermally-insulating material includes an arrangement of thermal sites, each having a reaction plate over which chemical reactions may occur. A heating element is positioned beneath each reaction plate, allowing for precise temperature control, which is crucial for the correct reactions. This platform can be utilized in various chemical and biological reactions, with the fluidic medium being an aqueous solution or other types of fluids.

Another significant patent involves integrated circuit packages designed to minimize stress on a semiconductor die. This integrated circuit package contains a semiconductor die and provides electrical connections between the die and additional electronic components. It effectively reduces stress placed on the semiconductor die due to movement caused by temperature changes or moisture levels. The package also mechanically isolates the semiconductor die from the integrated circuit package, enhancing its durability and performance.

Career Highlights

Ramji Lakshmanan is currently employed at Analog Devices International Unlimited Company, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of microfabrication and integrated circuits.

Collaborations

He has collaborated with notable coworkers such as Bernard Patrick Stenson and Paul Martin Lambkin, contributing to a dynamic and innovative work environment.

Conclusion

Ramji Lakshmanan's contributions to the fields of microfabrication and integrated circuit technology are noteworthy. His patents reflect a commitment to innovation and excellence in engineering. His work continues to influence advancements in chemical and biological applications, showcasing the importance of his inventions in modern technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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