The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Oct. 12, 2018
Applicant:

Analog Devices Global Unlimited Company, Hamilton, BM;

Inventors:

Oliver J. Kierse, Killaloe, IE;

Rigan McGeehan, Limerick, IE;

Alfonso Berduque, Crusheen, IE;

Donal Peter McAuliffe, Raheen, IE;

Raymond J. Speer, Dalkey, IE;

Brendan Cawley, Patrickswell, IE;

Brian J. Coffey, Ennis, IE;

Gerald Blaney, Limerick, IE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); B81B 7/00 (2006.01); G01N 33/00 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); G01N 27/404 (2006.01); H01L 25/065 (2006.01); B81C 1/00 (2006.01); H01L 23/055 (2006.01); H01L 23/24 (2006.01); H01L 23/49 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0051 (2013.01); B81B 7/0061 (2013.01); B81C 1/00269 (2013.01); G01N 27/404 (2013.01); G01N 33/0036 (2013.01); H01L 23/00 (2013.01); H01L 23/055 (2013.01); H01L 23/24 (2013.01); H01L 23/3185 (2013.01); H01L 23/49 (2013.01); H01L 23/49838 (2013.01); H01L 23/50 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); B81B 2201/0214 (2013.01); B81B 2207/012 (2013.01); B81C 2203/0154 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 2224/131 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83138 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/181 (2013.01); H01L 2924/182 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A gas sensor package is disclosed. The gas sensor package can include a housing defining a first chamber and a second chamber. An electrolyte can be provided in the first chamber. A gas inlet can provide fluid communication between the second chamber and the outside environs. The gas inlet can be configured to permit gas to enter the second chamber from the outside environs. An integrated device die can be mounted to the housing. The integrated device die can comprise a sensing element configured to detect the gas. The integrated device die can have a first side exposed to the first chamber and a second side exposed to the second chamber, with the first side opposite the second side.


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