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For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Nicholas Randolph Watts

USPTO Granted Patents = 18 

Average Co-Inventor Count = 3.2

ph-index = 6

Forward Citations = 274(Granted Patents)


Location History:

  • Beaverton, OR (US) (2003)
  • Phoenix, AR (US) (2014)
  • Phoenix, AZ (US) (2003 - 2024)

Company Filing History:

goldMedal17 out of 54,664 
 
Intel Corporation
 patents
silverMedal1 out of 832,680 
Other
 patents

Years Active: 2003-2024

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18 patents (USPTO):
1. 12107082 - Offset interposers for large-bottom packages and large-die package-on-package structures (2024-10-01),
2. 11978730 - Offset interposers for large-bottom packages and large-die package-on-package structures (2024-05-07),
3. 11798932 - Offset interposers for large-bottom packages and large-die package-on-package structures (2023-10-24),
4. 10607976 - Offset interposers for large-bottom packages and large-die package-on-package structures (2020-03-31),
5. 10446530 - Offset interposers for large-bottom packages and large-die package-on-package structures (2019-10-15),
6. 9960079 - Passive within via (2018-05-01),
7. 9780054 - Semiconductor package with embedded die and its methods of fabrication (2017-10-03),
8. 9607937 - Pin grid interposer (2017-03-28),
9. 8901724 - Semiconductor package with embedded die and its methods of fabrication (2014-12-02),
10. 8860205 - Method of stiffening coreless package substrate (2014-10-14),
11. 7952202 - Method of embedding passive component within via (2011-05-31),
12. 7952182 - Semiconductor device with package to package connection (2011-05-31),
13. 7851269 - Method of stiffening coreless package substrate (2010-12-14),
14. 7737025 - Via including multiple electrical paths (2010-06-15),
15. 7275316 - Method of embedding passive component within via (2007-10-02),

Title: Innovations by Nicholas Randolph Watts: Pioneering Offset Interposer Technologies

Introduction

Nicholas Randolph Watts, based in Phoenix, AZ, has emerged as a notable inventor with a remarkable portfolio of 18 patents. His innovative work primarily revolves around advanced packaging technologies, crucial for enhancing electronic device performance and efficiency.

Latest Patents

One of his latest patents focuses on "Offset Interposers for Large-Bottom Packages and Large-Die Package-on-Package Structures." This invention presents an offset interposer that features a land side with a land-side ball-grid array (BGA) and a package-on-package (POP) side, which contains a POP-side BGA. The design allows for unique configurations where each of the two land-side pads has a different footprint compared to their respective POP-side pads, thus optimizing electronic connections.

Career Highlights

Throughout his career, Nicholas has made significant contributions to the field of electronics, particularly while working with prominent companies like Intel Corporation. His innovative approach to interposer design has played a pivotal role in pushing the boundaries of electronic packaging technology.

Collaborations

In his journey, Nicholas has collaborated with talented professionals such as Todd B. Myers and Eric C. Palmer. These partnerships have fostered a creative environment conducive to pioneering new solutions in the electronics sector.

Conclusion

Nicholas Randolph Watts continues to make strides in the field of innovations, particularly in interposer technologies. His patents reflect a commitment to advancing electronic packaging, which is vital for the development of smaller, more efficient devices.

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