The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2018
Filed:
May. 17, 2013
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Todd B. Myers, Gilbert, AZ (US);
Nicholas R. Watts, Phoenix, AZ (US);
Eric C. Palmer, Tempe, AZ (US);
Jui Min Lim, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/768 (2006.01); H01L 21/48 (2006.01); H01L 23/64 (2006.01); H01L 23/66 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H05K 3/06 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76897 (2013.01); H01L 21/486 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/64 (2013.01); H01L 23/66 (2013.01); H05K 1/115 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 1/167 (2013.01); H01L 23/49822 (2013.01); H01L 2223/6616 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1902 (2013.01); H05K 3/06 (2013.01); H05K 3/4053 (2013.01); H05K 3/421 (2013.01); H05K 2201/086 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/09645 (2013.01); H05K 2201/09663 (2013.01); H05K 2201/09763 (2013.01); H05K 2201/09809 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09981 (2013.01); Y10S 257/916 (2013.01); Y10T 29/435 (2015.01); Y10T 29/49002 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49131 (2015.01); Y10T 29/49133 (2015.01); Y10T 29/49147 (2015.01); Y10T 29/49165 (2015.01);
Abstract
A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.