The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Oct. 31, 2014
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
John S. Guzek, Chandler, AZ (US);
Javier Soto Gonzalez, Chandler, AZ (US);
Nicholas R. Watts, Phoenix, AZ (US);
Ravi K Nalla, San Jose, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/03 (2006.01); H01L 25/10 (2006.01); H05K 1/18 (2006.01); H01L 21/768 (2006.01); H01L 25/07 (2006.01); H01L 23/31 (2006.01); H01L 25/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/56 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/768 (2013.01); H01L 23/49816 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/27 (2013.01); H01L 24/83 (2013.01); H01L 25/03 (2013.01); H01L 25/105 (2013.01); H05K 1/185 (2013.01); H01L 23/315 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/26 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/074 (2013.01); H01L 25/117 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/11831 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/26 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/451 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/821 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83874 (2013.01); H01L 2224/92132 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/40252 (2013.01); H01L 2924/40407 (2013.01); H01L 2924/40501 (2013.01); H05K 3/4682 (2013.01); H05K 2201/10477 (2013.01); H05K 2203/0152 (2013.01);
Abstract
Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.