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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8901724 B1

PDFFull Text
Date of Patent:
Dec. 02, 2014

Filed:

Dec. 29, 2009

Semiconductor package with embedded die and its methods of fabrication

Applicants:

John Stephen Guzek, Chandler, AZ (US);

Javier Soto Gonzalez, Chandler, AZ (US);

Nicholas R. Watts, Phoenix, AZ (US);

Ravi K. Nalla, Chandler, AZ (US);

Inventors:

John Stephen Guzek, Chandler, AZ (US);

Javier Soto Gonzalez, Chandler, AZ (US);

Nicholas R. Watts, Phoenix, AZ (US);

Ravi K. Nalla, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Winkle, PLLC

Primary Examiner:

Teresa M Arroyo

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/12 (2006.01); H01L 23/053 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 25/03 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H01L 25/10 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 2224/32145 (2013.01); H01L 2924/01046 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15311 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/01079 (2013.01); H05K 2201/10477 (2013.01); H05K 3/4682 (2013.01); H01L 23/49816 (2013.01); H01L 2924/1517 (2013.01); H01L 2224/32225 (2013.01); H01L 21/568 (2013.01); H01L 2224/83192 (2013.01); H01L 25/03 (2013.01); H01L 2225/1035 (2013.01); H01L 2924/01029 (2013.01); H01L 21/6835 (2013.01); H01L 2224/131 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/48091 (2013.01); H01L 2221/68345 (2013.01); H01L 23/49822 (2013.01); H05K 1/185 (2013.01); H01L 24/48 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/01078 (2013.01); H01L 23/49827 (2013.01); H01L 2924/014 (2013.01); H01L 2224/16225 (2013.01); H05K 2203/0152 (2013.01); H01L 2224/73265 (2013.01); H01L 25/105 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/01033 (2013.01);
Abstract

Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.

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