The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2017
Filed:
Dec. 19, 2011
Nicholas R. Watts, Phoenix, AZ (US);
Tao Wu, Chandler, AZ (US);
Nicholas R. Watts, Phoenix, AZ (US);
Tao Wu, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An interposer to form a frame around a bottom chip bonded to a package substrate and to standoff a top chip or package for clearance of the bottom chip. The interposer has pins arrayed on a first side which are soldered to the package substrate for reduced interposer z-height and pads arrayed on a second side to which the top package (chip) is bonded. During assembly, the interposer pins may be pressed against pre-soldered pads and the solder reflowed to join the interposer to the package substrate. A top package (chip) is then joined to an opposite side of the interposer to integrate the first and second chips.