Tokyo, Japan

Naoji Senba

This inventor holds 22 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Nec Corporation, Japan E.m. Co., Ltd.. Active years: 1994-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Naoji Senba. Retrieved from https://idiyas.com/inventor/naoji-senba

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 95.5

Average Co-Inventor Count = 3.0

ph-index = 12

Forward Citations = 803(Granted Patents)


Location History:

  • Toyko, JP (1999)
  • Tokyo, JP (1994 - 2004)

Company Filing History:


Years Active: 1994-2004

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Areas of Expertise:
Electronic Device Assembly
Bump Structure
Probe Card
Solder Ball Arrangement
Semiconductor Carrier
Three-Dimensional Memory Module
IC Package
Multistage Coupling
Thermal Management
Wiring Structure
Manufacturing Method
22 patents (USPTO):Explore Patents

Title: Innovations of Naoji Senba: Pioneering Electronic Device Assemblies

Introduction

Naoji Senba, a renowned inventor based in Tokyo, Japan, has made significant contributions to the field of electronics through his innovative patents. With a remarkable portfolio of 22 patents, Senba focuses on enhancing electronic device assembly methods and bump structures, leading to more efficient and compact electronic integrations.

Latest Patents

Among his latest patents, Senba has developed an "Electronic device assembly and a method of connecting electronic devices constituting the same." This invention introduces a novel electronic device assembly aimed at dense mounting of electronic devices. The assembly employs conductive portions implemented by metal bumps and sealing portions established by adhesive seal resin, connected through a thermocompression technique. This method can be applied repeatedly between three or more electronic devices, enhancing the compactness and reliability of electronic constructions.

Another significant patent is for a "Method for making a bump structure." This invention outlines the design of a bump structure with a hollow body that enables electrical connections between a first member and a second member. The method involves several steps, including preparing a molding plate to shape a bump-forming member, forming a conductive thin film to create a predetermined cavity, preparing a substrate for transferring the film, and eventually transferring the conductive thin film from the molding plate to the substrate.

Career Highlights

Naoji Senba's career includes valuable experiences at prominent companies such as NEC Corporation and Japan E.M. Co., Ltd. Through his work at these organizations, he has developed a deep understanding of electronic device technologies, leading to his innovative patent developments.

Collaborations

Throughout his career, Senba has collaborated with esteemed professionals in the industry, including Yuzo Shimada and Nobuaki Takahashi. Their partnerships have undoubtedly contributed to the successful development of his groundbreaking inventions.

Conclusion

Naoji Senba stands out as a key figure in the realm of electronic innovations, with a focus on enhancing device assembly techniques. His extensive patent portfolio demonstrates his commitment to advancing technology and improving connectivity in electronic devices. With ongoing contributions to the industry, Senba continues to pave the way for future developments in electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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