Fabrication method of plastic-molded lead component

Abstract

A fabrication method of a plastic-molded lead component is provided, in which leads are aligned at a fine pitch of approximately 100 .mu.m or less with a high accuracy, a simplified process sequence, and a low cost. First, a template having opened V-grooves is prepared. The V-grooves extend along a straight line and are aligned in parallel at a fixed pitch. Second, wire pieces are placed in the respective grooves of the template. Third, the placed pieces of the wire pieces are aligned in parallel on the template at a same pitch as that of the grooves. Fourth, a molding compound is supplied onto the template with or without the use of a mold to bury the aligned wire pieces placed in the grooves. Fifth, the molding compound supplied onto the template is cured to form an encapsulation plastic on the template. The wire pieces placed in the grooves are encapsulated by the encapsulation plastic in such a way that both ends of the wire pieces are exposed from opposite sides of the encapsulation plastic. The encapsulated wire pieces serve as leads. Finally, the template is removed from tie encapsulated wire pieces and the encapsulation plastic. The template is preferably formed by a semiconductor material such as silicon.