The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2001
Filed:
Nov. 09, 1998
Applicant:
Inventors:
Koji Soejima, Tokyo, JP;
Naoji Senba, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/09 ;
U.S. Cl.
CPC ...
H01R 9/09 ;
Abstract
Disclosed is a bump structure, which has a hollow body, for electrically connecting a first member and a second member. Also disclosed is a method for making a bump structure, which has the steps of: preparing a molding plate with a concave mold to mold a bump-forming member; forming a conductive thin film so as to form a predetermined cavity in the concave mold of the molding plate; preparing a substrate to which the conductive thin film is to be transferred; and transferring the conductive thin film formed on the molding plate to the substrate.