Yokohama, Japan

Naohisa Okumura

This inventor holds 25 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Technology. Top assignee: Kabushiki Kaisha Toshiba. Active years: 1998-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Naohisa Okumura. Retrieved from https://idiyas.com/inventor/naohisa-okumura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 25 

% Patents Active = 56.0

Average Co-Inventor Count = 2.8

ph-index = 7

Forward Citations = 90(Granted Patents)


Location History:

  • Tokyo, JP (2002)
  • Yokkaichi, JP (2004)
  • Yokohama, JP (1998 - 2012)
  • Kanagawa-ken, JP (2011 - 2013)
  • Kamakura, JP (2013 - 2015)
  • Kanagawa, JP (2012 - 2019)

Company Filing History:


Years Active: 1998-2019

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Areas of Expertise:
Semiconductor Device
Semiconductor Module
Semiconductor Memory Card
Semiconductor Storage Device
Memory Device
Manufacturing Method
Portable Storage Device
Resin-Sealed Type
Surface Mounting Type
Laminated Module
Relay Chip
Memory Device Manufacturing
25 patents (USPTO):Explore Patents

Title: Naohisa Okumura: A Pioneer in Semiconductor Innovation

Introduction

Naohisa Okumura is an esteemed inventor and engineer based in Yokohama, Japan. With a remarkable portfolio of 25 patents, Okumura has made significant contributions to the field of semiconductor technology. His innovative approaches have paved the way for advancements in electronic devices, underscoring his role as a key figure in the industry.

Latest Patents

Among his latest innovations, Okumura has developed two notable patents:

1. **Semiconductor Device**: This invention encompasses a semiconductor device that includes a first die pad, an adhesive, and a second die pad affixed to the top surface of the first die pad via the adhesive. The unique design involves a semiconductor chip mounted on the second die pad, which comprises a body portion and a protrusion portion. The entire assembly is enveloped in a package material while maintaining structural integrity, as the first die pad is designed to be as thick as the lead.

2. **Semiconductor Module**: This patent outlines a semiconductor module composed of a first semiconductor element, a second semiconductor element, and two light-emitting elements. The module is engineered to facilitate the complex interaction of light signals through specialized circuits, where each light-emitting element is strategically positioned to enhance functionality and performance.

Career Highlights

Naohisa Okumura is currently associated with Toshiba Corporation, a leading player in electronic innovation. His work at Toshiba has empowered the development of next-generation semiconductor solutions that are integral to modern electronic devices. His patents reflect practical applications that are essential for the evolving demands of technology.

Collaborations

Throughout his career, Okumura has collaborated with talented professionals, including Taku Nishiyama and Kiyokazu Okada. These partnerships have spurred innovation and fostered an environment conducive to groundbreaking developments in semiconductor technology.

Conclusion

Naohisa Okumura's inventive spirit and expertise in semiconductor technology are evident through his substantial patent portfolio. As he continues to push the boundaries of innovation at Toshiba, his contributions will undoubtedly shape the future of electronics, making him a pivotal figure in the realm of technology and invention.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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