The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2011

Filed:

Jan. 20, 2011
Applicants:

Taku Nishiyama, Yokohama, JP;

Kiyokazu Okada, Yokkaichi, JP;

Yoriyasu Ando, Yokkaichi, JP;

Tetsuya Yamamoto, Kamakura, JP;

Naohisa Okumura, Yokohama, JP;

Inventors:

Taku Nishiyama, Yokohama, JP;

Kiyokazu Okada, Yokkaichi, JP;

Yoriyasu Ando, Yokkaichi, JP;

Tetsuya Yamamoto, Kamakura, JP;

Naohisa Okumura, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor memory device is provided with a wiring board which includes an element mounting portion and connection pads. Plural semiconductor memory elements are stacked on the element mounting portion of the wiring board. The semiconductor memory element of a lower side has a thickness greater than that of the semiconductor memory element of an upper side. The semiconductor memory elements are electrically connected to the connection pads of the wiring board via metal wires.


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