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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9165870 B1

PDFFull Text
Date of Patent:
Oct. 20, 2015

Filed:

Jun. 24, 2011

Semiconductor storage device and manufacturing method thereof

Applicants:

Hitoshi Ishii, Kanagawa, JP;

Naohisa Okumura, Kanagawa, JP;

Taku Nishiyama, Kanagawa, JP;

Inventors:

Hitoshi Ishii, Kanagawa, JP;

Naohisa Okumura, Kanagawa, JP;

Taku Nishiyama, Kanagawa, JP;

Assignee:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Ori Nadav

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/18 (2006.01); H01L 23/50 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/3107 (2013.01); H01L 23/49855 (2013.01); H01L 25/18 (2013.01); H01L 23/49861 (2013.01); H01L 23/50 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19105 (2013.01);
Abstract

According to the embodiment, a semiconductor storage device includes an organic substrate, a semiconductor memory chip, a lead frame, and a resin mold section. The lead frame includes an adhering portion. The organic substrate is singulated to have a shape in which a portion in which the organic substrate does not overlap with the placing portion is larger than a portion in which the organic substrate overlaps with the placing portion, in plan view. The lead frame further includes a first extending portion in the adhering portion that extends to a surface different from a surface of the resin mold section on a side of an insertion direction.

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