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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9033248 B1

PDFFull Text
Date of Patent:
May. 19, 2015

Filed:

Jul. 20, 2012

Semiconductor storage device

Applicants:

Hidetoshi Suzuki, Kawasaki, JP;

Yuichi Hotta, Yokohama, JP;

Yuji Shimoda, Yokkaichi, JP;

Yuuji Ogawa, Yokkaichi, JP;

Taku Nishiyama, Yokohama, JP;

Tadanobu Okubo, Yokkaichi, JP;

Junichi Onodera, Yokohama, JP;

Takeshi Ikuta, Yokohama, JP;

Naohisa Okumura, Kamakura, JP;

Katsuyoshi Watanabe, Fujisawa, JP;

Kazuhide Doi, Yokohama, JP;

Inventors:

Hidetoshi Suzuki, Kawasaki, JP;

Yuichi Hotta, Yokohama, JP;

Yuji Shimoda, Yokkaichi, JP;

Yuuji Ogawa, Yokkaichi, JP;

Taku Nishiyama, Yokohama, JP;

Tadanobu Okubo, Yokkaichi, JP;

Junichi Onodera, Yokohama, JP;

Takeshi Ikuta, Yokohama, JP;

Naohisa Okumura, Kamakura, JP;

Katsuyoshi Watanabe, Fujisawa, JP;

Kazuhide Doi, Yokohama, JP;

Assignee:

KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Thien M Le

Assistant Examiner:

Claude J Brown

Int. Cl.
CPC ...
G06K 19/06 (2006.01); H01L 23/28 (2006.01); G06K 19/077 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/544 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H01L 25/16 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07732 (2013.01); H01L 24/49 (2013.01); H01L 2224/4809 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/19107 (2013.01); H01L 23/3107 (2013.01); H01L 23/544 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54486 (2013.01); H01L 25/0655 (2013.01); H01L 25/165 (2013.01); H01L 25/18 (2013.01); H01L 23/49838 (2013.01); H01L 23/49855 (2013.01);
Abstract

According to one embodiment, a semiconductor storage device is provided with a memory chip including a storage circuit, a controller chip that controls a memory chip, and a substrate having a first surface and a second surface opposing one another, on the first surface of which the controller chip is mounted. Further, the semiconductor storage device is provided with an external connection terminal formed on the second surface of the substrate, and resin that encapsulates the memory chip, the controller chip, and the substrate, includes a third surface and a fourth surface opposing one another, and has a predetermined mark directly printed only on the fourth surface that is adjacent to the second surface of the substrate.

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