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Fengshan, Taiwan

Nai-Wei Liu

USPTO Granted Patents = 21

Average Co-Inventor Count = 4.6

ph-index = 7

Forward Citations = 2,996(Granted Patents)

Location History:

Kaohsiung County, TW (2016 - 2019)
Fengshan, TW (2014 - 2022)

Company Filing History:

21 out of 40,850

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2014-2022

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21 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11532577 - Fan-out package and methods of forming thereof (2022-12-20),

2. 10867897 - PoP device (2020-12-15),

3. 10741511 - Fan-out package and methods of forming thereof (2020-08-11),

4. 10522439 - Semiconductor package device (2019-12-31),

5. 10366960 - Fan-out package and methods of forming thereof (2019-07-30),

6. 10083913 - Fan-out POP structure with inconsecutive polymer layer (2018-09-25),

7. 9978657 - Semiconductor package device and manufacturing method thereof (2018-05-22),

8. 9953907 - PoP device (2018-04-24),

9. 9824989 - Fan-out package and methods of forming thereof (2017-11-21),

10. 9553000 - Interconnect structure for wafer level package (2017-01-24),

11. 9466581 - Semiconductor package device and manufacturing method thereof (2016-10-11),

12. 9461018 - Fan-out PoP structure with inconsecutive polymer layer (2016-10-04),

13. 9379080 - Method and apparatus for a conductive pillar structure (2016-06-28),

14. 9312148 - Method of packaging a semiconductor device (2016-04-12),

15. 9230902 - Interconnect structure for wafer level package (2016-01-05),

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