The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Mar. 16, 2015
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Jing-Cheng Lin, Hsinchu County, TW;
Jui-Pin Hung, Hsinchu, TW;
Nai-Wei Liu, Fengshan, TW;
Yi-Chao Mao, Zhongli, TW;
Wan-Ting Shih, Touwu Township, TW;
Tsan-Hua Tung, Hsinchu, TW;
Abstract
A method of packaging a semiconductor device includes forming an insulating layer over a semiconductor device, wherein the semiconductor device has a contact pad, and a thickness of the contact pad is greater than a thickness of the insulating layer. The method further includes forming a molding compound to cover the semiconductor device and a space between the semiconductor device and a neighboring semiconductor device, wherein both semiconductor devices are on a carrier wafer. The method further includes planarizing a surface of the semiconductor device by removing the molding compound and the insulating layer over the contact pad.