The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
May. 17, 2018
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 21/311 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/31133 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 23/3171 (2013.01); H01L 23/5389 (2013.01); H01L 24/03 (2013.01); H01L 24/10 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/18 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/03001 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/19 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/94 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor device includes a die having a pad, a passivation disposed aver the die and a portion of the pad, a polymer disposed over the passivation, a molding surrounding the die and the polymer, and an interface between the polymer and the molding. The interface and the passivation define an angle less than or greater than approximately 90°.