Myra McDonnell

Title: Myra McDonnell: Innovator in Integrated Circuit Technology

Introduction

Myra McDonnell is a prominent inventor based in Portland, OR (US). She has made significant contributions to the field of integrated circuit technology, holding a total of 5 patents. Her work focuses on innovative solutions that enhance the performance and reliability of electronic devices.

Latest Patents

One of Myra's latest patents is titled "Stress compensation for wafer to wafer bonding." This invention describes techniques for bonded wafers that include a first wafer bonded with a second wafer, along with a stress compensation layer. The first wafer exhibits varying stress levels at different locations, and the stress compensation layer is designed to induce specific stress levels to optimize performance.

Another notable patent is "Integrated circuit structures having differentiated neighboring partitioned source or drain contact structures." This patent outlines an integrated circuit structure that features differentiated neighboring partitioned source or drain contact structures. It includes multiple gate stacks and epitaxial source or drain structures, enhancing the functionality and efficiency of integrated circuits.

Career Highlights

Myra McDonnell is currently employed at Intel Corporation, where she continues to push the boundaries of technology. Her innovative work has positioned her as a key player in the development of advanced electronic components.

Collaborations

Throughout her career, Myra has collaborated with talented individuals such as Mauro J Kobrinsky and Chytra Pawashe. These collaborations have fostered a creative environment that has led to groundbreaking advancements in her field.

Conclusion

Myra McDonnell's contributions to integrated circuit technology exemplify her dedication to innovation and excellence. Her patents reflect her expertise and commitment to advancing the industry, making her a notable figure in the world of technology.